News
Sponsored by the ESD Association (Rome, NY), the 2004 EOS/ESD Symposium will package research, technology and education into one international electrostatic discharge (ESD) event Sept.19-23 at the Gaylord Texan Resort and Conference Center in Grapevine, TX.
The program is organized in three special interest tracks: ESD Test, Failure Analysis and Systems; Factory, Materials and ESD Control; and Device, Design and Technology. Attendees will be able to customize their experience along their specific areas of interest.
This year's symposium features 51 papers to be presented in 10 parallel technical sessions: MR Heads - Processing; RFIC and Novel Protection Devices; System Level and Other ESD Issues; On-Chip Protection Strategies, Physics and Modeling; Tester - Device Effects; Analysis and Modeling of ESD Design Failures; Factory and Materials; Characterization of On-Chip Protection; Novel TLP Testers; and Magnetic Recording Heads.
The technical sessions also feature the award winning paper from the 2003 RCJ EOS/ESD Symposium-Japan: ESD Protection Design Using a Mixed-Mode Simulation for Advanced Devices by H. Hayashi, S. Kuroda, K. Kato, K. Fukuda, S. Baba and Y. Fukuda of Oki Electric Industry Co., Ltd.
The week's events open with three full-day ESD tutorials. An additional 17 tutorials will be offered throughout the week, covering topics such as Air Ionization: Issues and Answers; Packaging Principles for the Program Manager; Device Technology and FA Overview; Electrostatic Calculations for the ESD Engineer; and Cleanroom Considerations for the Program Manager.
A two-day seminar, ESD Program Development and Assessment (ANSI/ESD S20.20), will take place on September 19-20.
Eight interactive workshops will cover Silicon Technology Scaling and ESD Reliability - Roadmap and Reality; Common Auditing Issues; ESD in Cleanrooms; Can TLP Go Beyond HBM and CDM?; Ionization Issues; Automated Equipment, ESD and Grounding Issues; ESD in Magnetic Recording, and HBM-TLP Testing Miscorrelation: Experiences, Explanations and Solutions.
Attendees also will have the opportunity to visit exhibit booths displaying ESD control products and services. The exhibits are open to anyone interested in EOS and ESD; symposium registration is not required to attend the exhibits.
Other events include a Welcome Reception, an Awards Breakfast, a Professional and Technical Women's Reception, the ESD Association Annual Meeting and Luncheon, Authors' Corners to discuss the technical papers with the authors and ESD training presentations.
The detailed program is available at: www.esda.org/symposia.html.
Copyright 2004, UP Media Group. All rights reserved.
Hover-Davis, Inc. (Rochester, NY) has hired Darrell R. Tullar as Marketing Manager. In this new role, Tullar will lead global technical and promotional marketing activities and strategies. His focus will be on market growth and increasing sales.
Tullar comes to the company with over 24 years of experience in the electronics industry. He has held positions in customer service, product management, marketing and sales, while at Motorola, Universal Instruments & PMJ Automec.
Copyright 2004, UP Media Group. All rights reserved.
The Surface Mount Technology Association (SMTA, Minneapolis, MN) is co-locating its annual conference, SMTA International, with the Assembly Tech Expo on September 26-30, in Rosemont, IL.
Many events are planned for industry professionals who have an interest specifically in lead-free soldering technology. To help industry professionals prepare for the 2006 deadline, this year's event will feature eight short courses, close to 40 technical papers and a Lead-Free Soldering Symposium.
The short courses will cover: Lead-Free Solder Joint Reliability; Lead-Free Conversion Project; Real Time Process Control, Including Lead-Free; Lead-Free Rework; Lead-Free Surface Finishes; Implementing Lead-Free at Your Facility; The Real Cost of Lead-Free; and Ten Steps to an Effective RoHs Compliance Process.
The technical papers will cover printing, selective soldering, moisture-sensitive devices (MSD), rework, ball grid array (BGA), flip chip, harsh environments, surface finishes, automated optical inspection (AOI), x-ray, tin whiskers, lead-free materials, processes and reliability.
Organized by Dr. Paul T. Vianco of Sandia National Labs, the symposium will provide technical information on alternative materials systems, tin whiskers, lead-free processing techniques and the growing knowledge base of lead-free solder joint reliability, as they related to lead-free technology.
Additionally, a free session entitled "Lead-Free: Where Are We Right Now?" will explore the transition from standard leaded solders in a volume-manufacturing environment with papers from Agilent, Flextronics and Indium Corp. of America. The SMTAI Opening Ceremony will focus on RoHS Compliance.
Copyright 2004, UP Media Group. All rights reserved.
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