News
BANNOCKBURN, IL – Total North American EMS orders in May rose 10.5% year-over-year and decreased 19.2% sequentially, according to IPC.
BANNOCKBURN, IL — North American printed circuit board shipments rose 9.1% year-over-year in May, IPC announced today.
AUSTIN, TX -- TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager