News
The International Reliability Physics Symposium (IRPS) has announced that Dr. Hans Stork, chief technology officer of Texas Instruments, will be the keynote speaker at IRPS 2004. The 42nd annual symposium for the scientific exploration of microelectronic reliability will take place April 25-29, at the Hyatt Regency Phoenix at Civic Plaza, Phoenix, AZ.
Dr. Stork, who was recently named CTO after serving as senior vice president of Silicon Technology Development at TI, will discuss "Reliability Challenges of sub 100nm-CMOS SoC."
Other highlights of the symposium will include technical sessions featuring the largest number of papers submitted and accepted in IRPS history. The two day tutorial series on reliability engineering for upcoming professionals features sessions on Future CMOS, Gate Dilelectrics, Low K/Cu Interconnects, RF/MMIC Reliability, Failure Analysis, General Reliability, Design Practices, ESD, High K Dielectric, NBTI and SER. The conference will also feature a poster session, a half-day Reliability-Year-In-Review seminar and a technically oriented, hands-on exhibit that will allow attendees to test and evaluate state of the art reliability analysis equipment.
The three-day technical program kicks off with Novel Transistor Reliability Findings, followed by sessions on transistors, back-end integration, gate dielectrics (SIO2 and High-K), latchup, products and circuits, memory, interconnects, MEMS, SER/SEU,ESD, back-end dielectrics and failure analysis.
Dr. Stork joined TI in 2001 from Hewlett-Packard, where he served as director of the Internet systems and storage lab at HP Laboratories, and earlier as the director of the ULSI research lab.
Dr. Stork has written or co-authored approximately 90 papers and holds five patents. He was elected IEEE Fellow in 1994 for his contributions to SiGe devices and technology and is also a fellow member of the IEEE Electron Devices Society, where he has served on and chaired a number of committees.
Dr. Stork joined the Sematech board of directors in 2002 after serving for several years on the organization's executive technical advisory board. He also has been a board member of the Semiconductor Research Corp. since 1999 and serves on the Semiconductor Industry Association's (SIA) technology strategy committee. Additionally, he served as a technical advisor to government efforts on high-performance computing benchmarks and the national security issues emerging from Internet computing.
Copyright 2004, UP Media Group. All rights reserved.
During the run-up to the change to lead-free solders by July 2006, a number of end users have expressed concerns about the reliability of soldered joints formed by mixtures of tin/lead (SnPb) and lead-free materials. These will arise when lead-free components are soldered using SnPb alloys, something already happening in many production lines, and later when SnPb components are soldered with lead-free alloys. The latter issue may be a significant problem for companies that have had to invest in lifetime purchase of components. Several workers have already published information that suggests that small levels of lead contamination in lead-free joints can significantly reduce joint performance.
Many of those concerned end-users approached National Physical Laboratory (NPL, Teddington, UK) to assist with clarification of any reliability issues during the transition period. A consortium of 16 contributing companies was formed with a work program. The work will cover reliability assessment of lead-free joints to SnPb components; reliability assessment of SnPb joints to lead-free components; evaluation of hot-peel strength of lead-contaminated lead-free joints; and applicability of lead indicator kits for paints for recognition of lead-containing components
The work, lead by Martin Wickham, is underway and results are expected in the next 12 months.
Participating partners include:
Aeroflex International Ltd.
AMS Space UK
BAE SYSTEMS (Operations) Ltd.
Celestica Ltd.
Department of Trade & Industry
Dolby Laboratories Inc.
Eurotherm Ltd.
Goodrich Engine Control Systems
Hansatech Group
National Physical Laboratory
Robert Bosch GmbH
Rolls Royce Naval Marine
TRW Automotive
Thales Missile Electronics Ltd.
For more information please contact Dr. Chris Hunt: +44(0)20 8943 7027; email: chris.hunt@npl.co.uk.
Copyright 2004, UP Media Groups. All rights reserved.
Concoat Ltd. (Fleet, UK) has engineered a water-based conformal coating addition to its Humiseal range that can protect electronics assemblies at temperature extremes beyond the capabilities of existing resin-based alternatives. The performance characteristics of Humiseal 1H20 stem from a new water-based chemical formulation that was engineered by Concoat and took over a year of research and development to produce.
"1H20 is currently undergoing qualification testing between -65°C and +185°C," said Concoat's technical director, David Greenman. "Because the top end figure is at least 50°C higher than conventional resin materials, this product will be especially relevant to the automotive industry where upper performance limits are ideally rated at 180°C for engine bay electronics."
As water-based coatings, the series is also environment-friendly to meet with the drive in Europe to reduce volatile organic compounds (VOCs).
Concoat's chief chemist Phil Kinner, said, "The coating is both safe and easy-to-use, it has a superior 8kV breakdown voltage that is higher than conventional resin, it is extremely flexible and offers excellent chemical and mar resistance, and is repairable. And by being non-hazardous and low odor, it greatly reduces the demands on fume extraction equipment."
Managing director Graham Naisbitt said, "It also meets the growing demand for higher performance conformal coating materials capable of protecting modern printed circuit boards (PCBs) that exploit ever greater packaging densities allied with reduced conductor widths and spacings that are now being used in increasingly hostile operating environments."
1H20 AR7 Par 2 is qualified to MIL-I-46058C and IPC CC-830B. UR3 meets requirements for IPC-CC-830B and UR4 MIL-I and CC-830-B are pending.
Copyright 2004, UP Media Group. All rights reserved.
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