News
Minneapolis, MN - The SMTA's Pan Pacific Microelectronics Symposium & Exhibit (smta.org/pan_pac/) will take place Jan. 25-27, 2005, at the Sheraton Kauai Resort in Kauai, HI. Kei Biu, of SMT Corp, will give the keynote presentation on Green Electronics in China.
The technical program will consist of sessions on 3-D Chip Stacking, System in Package (SiP), RF & Sensor Technologies, High Performance Packaging and Assembly Management Strategies.
Additional sessions will cover Pb-Free Reliability, Solder and Rework Processes, Pb-free Microstructures and Performance, Pb-free Implementation, Package Solder Joint Reliability and Electronic Adhesives, Chip Attach and Materials Technologies, Cleaning and Surface Treatments, Packaging and Assembly Trends, and Inspection and Test.
The event averages more than 100 participants annually from 15 different countries throughout Europe, the Americas and the Pacific Basin.
For more information, contact JoAnn Stromberg: 952-920-7682; joann@smta.org.
Endicott, NY -- Endicott Interconnect Technology was recently issued a patent to improve package reliability, its second since the company's formation in 2002.
In late October, EI received their first U.S. Patent (6,809,269) "Circuitized Substrate Assembly and Method of Making Same" - a multilayer printed circuit that uses conductive paste to form electrical connections between layers of the structure.
This was followed by the U.S. patent issued this week (6,815,837), "Electronic Package with Strengthened Conductive Pad" - an approach to strengthening the design of printed circuits to improve their reliability when assembled with components.
Endicott engineers have filed over 38 U.S. patent applications to date.
Las Vegas, Nov. 12 -- The mood was cautious among the 40 companies that presented at Deutsche Bank's annual semiconductor conference in Las Vegas over the past two days.
Among a generally subdued mood, most companies view the current soft patch as only a mid-cycle correction resulting from an inventory hiccup. Positive anecdotes came from Xilinx, suggesting that its business in China has improved over the past month, and Micrel, whose POS from distribution in October was flat to up month-on-month. On the other hand, National Semiconductor and Atmel were cautious (Atmel has not seen a pickup in Q4 orders).
Avnet senior VP and CFO Ray Sadowski fielded several questions after his presentation, mostly on inventory. After seeing inventory increase 12% over the past two quarters (while sales fell 1%), the company plans to reduce inventory over the next several months. Sadowski seemed confident that fundamentals would improve by the March or June quarter.
According to DB, distribution industry fundamentals will likely deteriorate in the near-term. Slowing end-market demand, deteriorating commodity prices and more aggressive pricing among distributors will make it difficult for companies to demonstrate even modest margin expansion over the next six to 12 months.
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