News
IPC (Northbrook, IL) has announced the collection of free events planned for its co-located IPC SMEMA Council's APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, being held Feb. 24-26, 2004, at the Anaheim Convention Center, in Anaheim, CA.
In addition to the complimentary keynote addresses of Solectron president and chief executive officer Michael Cannon, industry forecaster Walt Custer and the multi-talented Bill Nye-The Science Guy, the trade show will feature eight free forums throughout the exhibition and conference. The schedule includes:
1) Beyond Lead Free-WEEE/ROHS on Feb. 24
Chair: Fern Abrams, IPC
This
panel discussion will provide insights into what leading companies are
doing to prepare for the July 2006 lead-free compliance deadlines along
with the latest developments in legislation, exemptions and definitions
of lead free under Waste Electrical and Electronic Equipment (WEEE) and
Restriction on Hazardous Substances (RoHS). Additionally, the panel of
experts will examine the ripple effects of this legislation on laws and
regulations in the U.S. and abroad.
2) North America or Asia: Where is the Best Place for Your Manufacturing? on Feb. 25
Chair: Lisa Hamburg, Circuits Assembly magazine
The
relative complexity, quantity required, circuit density, level of
customization needed and delivery time frame are just a few of the
issues that help determine the supply source. This panel discussion
will discuss and debate the various pros and cons of overseas sources.
3) IPC PCQR2 Database-Globally Accepted de facto Standard for
Comparing Process Capability, Quality and Relative Reliability of PCB
Suppliers on Feb. 24
Chair: David Wolf, CAT, Inc.
The IPC D-36
Subcommittee has developed an industry standard, IPC-9151A, for process
capability test panel designs and the PCQR2 database detailing the
capabilities of printed circuit board (PCB) suppliers. The database
provides quantitative data that allows subscribers to statistically
benchmark board suppliers' capabilities; perform intelligent sourcing;
select new suppliers; ensure design for manufacturability; and
establish realistic design rules. The seminar will include in-depth
discussions on the test panel designs, analysis reports and the
capabilities of the PCB supply chain documented in the database.
4) Domestic PCB Technology Innovations at the U.S. Naval Surface Warfare Center, Crane Division on Feb. 26
Chair: Bill Payne, EG&G Crane Operations
The
Emerging Critical Interconnect Technology (ECIT) program was created to
co-opt military, academic and industrial extension for the purpose of
facilitating North American research and development consistent with
IPC's technology roadmap. This presentation will provide insight into
ongoing ECIT projects, their goals, status, the participants and
potential delivery schedules.
5) NEMI Defective Parts per Million Opportunities (DPMO) Project Forum on Feb. 25
Chairs: Tim Kruse, Plexus NPI Plus, and David Mendez, Solectron Texas LP
The
NEMI DPMO project team is nearing completion of an investigation into
package-level DPMO rates throughout the electronics assembly industry.
Such DPMO data can be used to quantify the expected fault spectrum on a
particular PCB assembly, enabling manufacturers to more accurately
assess the cost of assembly, test, repair and scrap and also estimate
the shipped product quality level of a product. Participants in the
NEMI DPMO Project Team will present findings from the study, share the
lessons learned and discuss the vision for follow-up on DPMO efforts in
the industry.
6) Will the Real Immersion Silver Please Stand Up? on Feb. 24
Chairs: Kim Hyland and Dave Mendez, Solectron
As
consumers demand more cutting-edge electronic devices, as original
equipment manufacturers (OEMs) design higher functioning boards and as
chemical companies make new PCB surface finishes, fabricators and
assemblers need to endure the fast progression of all these changes. In
this session, representatives from fabrication, assembly, OEM and
chemical supply companies will answer all questions and concerns
relating to the implementation of immersion silver.
7) Reactivation of IPC's OEM Council on Feb. 25
Chair: Daryl Sato, Intel Corp.
IPC
is reactivating its OEM Council, which has made significant
contributions to efficiency in the supply chain through development and
release of standardized vendor surveys. The council's mission is to
develop and use a methodology for PCB technology and assessment and
advancement, evaluate PCB supplier process capabilities, identify
technology gaps and monitor R&D advancements and PCB design changes
to ensure gap closure. The panel will discuss their working group
efforts and solicit feedback on ways to integrate and expand such
collaborative projects through the OEM Council.
8) International Technology Interchange-Total Packaging Solution Roadmap on Feb. 24
Chair: Dieter Bergman, IPC
This
forum will discuss global industry needs and how international
organizations are involved in developing common ways of understanding
future development and improving the international supply chain. The
panelists will cover various topics, ranging from the definition of
Jisso to the hierarchy of electronic packaging to optoelectronics and a
global outlook on lead and halogen free.
For more information about these events, visit http://shows.ipc.org or contact Joe Dudeck, IPC communications manager, JoeDudeck@ipc.org.
Copyright 2004, UP Media Group. All rights reserved.
LPKF Laser & Electronics (Wilsonville, OR) has announced the release of the low cost SL740 surface-mount technology stencil laser cutter. The system is designed for low- and medium-volume stencil production, cutting up to 3,000 apertures per hour.
The cutter uses the same proprietary high power infrared laser source compliant with laser safety class 1 as found in LPKF's higher-end models. The entry-level system provides high accuracy and reliability, making it ideal for start-up stencil businesses or a backup system for established shops. It offers a cutting area of 29 x 29 in. and accommodates all common stencils, including stencils for quick release frames. Mounting fixtures are provided for both bare sheets and framed stencils.
"With the introduction of the SL740, we are excited to better address the entry-level market space, while maintaining the signature reliability and accuracy of LPKF's products," said Stephan Schmidt, vice president of LPKF North America.
Copyright 2004, UP Media Group. All rights reserved.
Reptron Electronics Inc. (Tampa, FL), an electronics manufacturing services company, reported that its Second Amended Plan of Reorganization under Chapter 11 of the Bankruptcy Code was confirmed by the U.S. Bankruptcy Court on Jan. 14, 2004. Reptron anticipates the effective date of this confirmation to occur on Jan. 26, 2004, which is about 90 days from the original filing date.
Under the confirmed plan of reorganization, the company's unsecured class of creditors that includes its existing convertible notes will receive new notes with a total principal amount of $30 million. The existing notes, along with all accrued and unpaid interest, will be cancelled. The unsecured class of creditors will also receive 95% of the common shares of the reorganized company. Existing common shareholders will receive the remaining 5% of the common shares of the reorganized company.
"The restructuring of our convertible notes is a key component in our strategic plan, which we believe positions the company to take advantage of future growth opportunities," said Paul J. Plante, Reptron's president and chief operating officer. "Once the restructuring is completed, Reptron will have reduced its debt load by over $70 million over the past 12 months. We are extremely pleased to have completed this restructuring in such a short time frame."
Copyright 2004, UP Media Group. All rights reserved.
