News
IPC (Northbrook, IL) has announced the schedule for its second annual Sacramento Day, taking place Feb. 3-4, 2004, at the California Chamber of Commerce headquarters in Sacramento, CA.
Open to all companies in the electronic interconnection industry with operations in California, IPC and its California Circuits Association's (CCA) two-day event will assist businesses in lobbying the California Legislature to develop and pass a pro-growth, pro-manufacturing, fiscally responsible agenda for California's printed circuit board industry.
On the evening of Tuesday, Feb. 3, participants will kick off the event with dinner and a presentation by Richard Costigan, legislative secretary for Governor Arnold Schwarzenegger. Costigan will address the attendees on the Governor's recently released 2004 budget blueprint and present the keys to returning California to fiscal stability.
Fred Main, counsel, government and policy division of Manatt, Phelps and Phillips LLP, will commence Wednesday's activities with a primer on lobbying the California Legislature. Then, Dominic DiMare, vice president of government relations for the California Chamber of Commerce, will discuss the key business issues facing the legislature in 2004.
Next, the attendees will meet their Assembly Members and Senators to share crucial industry concerns, such as workers compensation reform and the creation of a pro-business environment to foster increased investment, innovation and jobs in California's high-tech manufacturing community.
After a morning of lobbying, the attendees will hear luncheon speaker Dan Walters, political columnist for the Sacramento Bee, discuss the historic recall effort, the election of Governor Schwarzenegger and its impact on the political environment in the Golden State. Following lunch, attendees will participate in afternoon lobbying visits before a wrap-up session to compare notes from the day.
For more information, visit www.calcircuits.org/sacday or contact Dick Crowe, CCA's executive director, (714) 343-6267.
Copyright 2004, UP Media Group. All rights reserved.
"As the U.S. encounters new global realities policy makers face a choice: we can compete in the international arena or we can retreat," said Craig Barrett, chief executive officer of Intel Corp. "America can only grow jobs and improve its competitiveness by choosing to compete globally, and that will require renewed focus on innovation, education and investment."
In a report issued today, the Computer Systems Policy Project said U.S. companies "must engage in business worldwide to capitalize on opportunities and respond to competitive challenges."
"Countries that resort to protectionism end up hampering innovation and crippling their industries, which leads to lower economic growth and ultimately higher unemployment," said CSPP in its report.
CSPP, whose members include Michael Dell, Carly Fiorina, Sam Palmisano, Joseph Tucci, Ed Zander and Barrett, among others, lobbied Congress for programs that promote technological innovation and improve education and training for American students and workers.
"As a nation we must renew our investment in competitiveness, just as businesses must do," said Fiorina, chairman and CEO of HP. "Today we're calling on our national leaders to partner with the private sector to develop a competitiveness agenda that maintains the processes and discipline that made the U.S. the leading technology exporter it is today."
Barrett said white-collar jobs in the U.S. are no longer a guarantee. "It had been assumed we had a lock on white-collar jobs and high-tech jobs. That is no longer the case."
Noting the disparity in federal subsidies for agriculture, which number the in the tens of billions of dollars, versus those for physical sciences--reportedly just $5 billion--Barrett said, "I can't understand why we continue to pour resources into the industries of the 19th century."
AMTECH Inc. (Branford, CT), a supplier of solder powders, pastes, fluxes and associated products used in electronic assemblies, has introduced NoVOC™, a water-based, no-clean liquid flux for use in wave soldering.
The low solids liquid flux contains no rosins, resins or volatile organic compounds (VOCs). It improves solder joint reliability and reduces the risk of rework since it leaves no insulating residue on test pads or conductive pads. The no-clean formula eliminates the need for wash-up, since any residual flux residues are non-corrosive and halide-free.
The flux features low surface tension, for wetting prior to wave soldering double sided or multi-layer boards. It is ideal for board assemblies containing sensitive sliding switches or conductive carbon pads.
With water as the main ingredient, the flux is inherently more economical to manufacture than rosin-based fluxes. As a non-hazardous material, it easily transported and contains no irritants.
The flux is available in 1, 5 and 55 gallon containers. It can be applied by spraying or dipping and can be diluted when required by using deionized water.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- KIC to Exhibit at Four SMTA Expo & Tech Forums in August
- Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service
- Automatic Nozzle Height Adjustment Reduces the Potential for Soldering Defects in Wave Soldering Processes
- BTU International Appoints E-Tronix as Its Representative in Six States