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SAN JOSE, Oct. 4 -- EDA revenue rose 4% in the June quarter versus one year ago, reaching $993 million, the EDA Consortium said today. The rise wasn't enough to convince one chief executive of a leading EDA company that the industry was performing up to par, however.

"Despite very modest growth in the EDA industry, there are no indications of overall strength," Wally Rhines, chairman of the EDA Consortium and chairman and CEO of Mentor Graphics, in a statement. "Growth in services versus last year is positive but the sequential decline is not."

For the quarter, computer-aided engineering revenues were $474 million, up 4% year-on-year. License and maintenance grew 2% year-on-year. Services was up 11% to $70 million. IC physical design and verification sales fell $3 million, to $282 million.

PCB and MCM layout revenues were $84 million, down 1% from Q2 2003.

The semiconductor intellectual property (SIP) revenue rose 28%, to $84 million. The sector was helped by greater SIP participation in EDAC's data collection.

Revenues in North America and Europe increased 4% each, to $523 million and $180 million, respectively. Japan was down 5%, to $176 million. Rest-of-world, which includes China and India, was up 19%, to $115 million.

The sector employed 20,000 in Q2, up 6% vs. a year ago and a new high since EDAC began tracking employment data four years ago.

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INDUSTRY, CA, Oct. 1 --  Following three years of intensive evaluation Motorola has qualified a lead-free solder paste from Henkel Electronics.

"I think the great advantage of this material is that it provides a very wide process window, which gives us tremendous flexibility," says Vahid Goudarzi, a distinguished member of the technical staff at Motorola. "From printing to reflow, we really stressed the material and it was able to meet our very rigorous technical requirements."

Multicore LF320 requires a minimum peak reflow of 229°C, about 11°C lower than standard lead-free pastes. (Higher Dt assembly designs can be reflowed in air at up to 260°C.) The difference provides a safety margin when reflowing temperature-sensitive components. According to Henkel, the paste prints at a speed range of 25-100 mms-1 (6"s-1), wets on a range of surface finishes, and has been formulated to provide high resistance to slump and solderballing.

LF320 is classified as a ROMO per J-STD-004 and meets or exceeds Bellcore GR-78-CORE tests for electromigration.

The material has been optimized for reflow in air on a range of PCB assembly applications and reflow profiles may be extended with nitrogen, Henkel said in a press statement.

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Good call: Henkel's Chris Korth (left) and Cary Vocelka (right) receive the good news from Vahid Goudarzi of Motorola.

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DES PLAINES, IL, Oct. 1 — Kester will open a solder manufacturing facility in Mexico, the company said today. The Nogales plant will manufacture solder pastes, wire products and fluxes.

"Expansion into Mexico supports our strategy to deliver globally," Kester vice president of marketing and business development David Torp said in a press statement. Torp noted the years-long migration of assembly operations into China, Mexico and Eastern Europe.

Kester plans additional plants in Suzhou, China, in 2005, and Plauen-Neuensatz, Germany, which has been operational since June.

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