News
Universal Instruments (Binghamton, NY) and Hitachi High Technologies (HHT, Schaumburg, IL) have renewed their successful original equipment manufacturer (OEM) agreement for a further five years. HHT acquired Sanyo High Technologies, Universal's original OEM partner, in 2003. The partnership has enhanced Universal's turret-style high-speed placement (HSP) technology while affording HHT an extensive sales and support network.
Since it was first announced in 1989, the agreement has resulted in more than 1200 HSP platforms sold. Continued success of the partnership and sustained market demand for HSP equipment have allowed the agreement to be renewed several times in the past.
In addition to customers' access to the entire line of 4797-series HSP machines, extending the agreement until 2009 will allow further joint efforts to continue. Such efforts include recent line software development work and may extend in the future to additional joint technical projects, technology transfers and further product sharing.
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), an electronics contract manufacturer and printed circuit board (PCB) fabricator, has become the first company to enter a world-wide licensing agreement under Nortel Networks' Channel Routing technology licensing program, authorizing it to design and manufacture PCBs using Nortel Networks' patented technology.
Channel Routing allows designers the opportunity to improve the routability of signals out of dense array packages and potentially reduce the number of layers required to interconnect components. It is an algorithm that utilizes blind vias and/or microvias to open up routing channels in dense array packages allowing for improved wiring density. A software layout tool works with Sanmina-SCI's current ECAD tool to allow for auto-routing of designs with high I/O array packages, such as ball grid arrays (BGAs), speeding up the design process.
George Dudnikov, senior vice president and chief technology officer of Sanmina-SCI's PCB Division, said, " This is an opportunity for us to license someone else's innovation and provide products and services which utilize this licensed technology to all of our customers in addition to Nortel Networks. It also demonstrates a close collaboration between an original equipment manufacturer (OEM) and EMS partner in developing and commercializing new technology."
"By using our patented Channel Routing technology, complex PCBs can be designed with fewer layers, thereby enabling even higher density products, improved manufacturing yields, and overall, a more cost effective PCB," said Ryan Stark, vice president, Advanced Technology Investments, Nortel Networks. "Channel Routing will benefit those who are pushing the envelope in complex PCB design."
With this license, Sanmina-SCI is immediately able to offer Channel Routing to all of its board layout and PCB customers.
Copyright 2004, UP Media Group. All rights reserved.
AIM (Montreal, Canada) has announced an all day lead-free seminar to take place in Sydney, Autralia, on March 23, 2004. Future workshops are being planned at various locations worldwide.
To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to quality, must have a solid understanding of the changes required of them.
While there are many theoretical workshops on lead-free assembly, this seminar focuses on the practical considerations for achieving successful lead-free assembly at a factory. Each step of the manufacturing cycle is addressed, from purchasing parts to inspecting assembled board.
Some of the lead-free assembly topics to be presented include: the status of lead-free legislation, marketing and implementation worldwide; reasons for hesitating to move towards lead-free soldering; design, component flux and solder alloy considerations; lead-free alloy requirements and materials management issues.
The instructor of the workshop is Karl Seelig, vice president of technology of AIM. In his 25 years of industry experience, Seelig has authored over 20 published articles on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection and metallurgical studies. Seelig has numerous awards and patents in soldering technology—including four for lead-free solder alloys—and has been one of the key developers of no-clean technology.
To participate, contact AIM Products Australia: (02) 47356775, or email: tweber@aimsolder.com.au.
Copyright 2004, UP Media Group. All rights reserved.
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