News
Cookson Group plc (London, UK), an international materials technology company, announced the appointment of Nick Salmon as Group Chief Executive.
Salmon has held leadership positions within major international organizations over many years. At Babcock International plc, the engineering services group, he was chief executive from 1993 to 1997. From 1997 to 2001, Salmon was executive vice president of ABB Alstom Power and president of Alstom's Energy Sector. From 2001 until March of this year, he was executive vice president of Alstom SA.
In May, Cookson announced that Stephen Howard intended to relinquish the role of group chief executive, after the identification and appointment of a successor. Howard will step down as on July 19, and will continue as an executive director until the end of the year.
The company also announced the appointment of Jan Pieter Oosterveld as a non-executive director, with immediate effect.
Oosterveld spent his career at Royal Philips Electronics. Until his retirement in March, he was a member of the Group Management Committee, CEO of Philips Asia Pacific, Chairman of the Board of Directors of LG.Philips LCD Seoul, South Korea and Vice-Chairman of the Supervisory Board of LG.Philips Displays NV, Hong Kong.
Copyright 2004, UP Media Group. All rights reserved.
Indium Corp. (Clinton, NY) has promoted Leo M. Devine to market development manager for wave solder products.
In this role, Devine will be responsible for the marketing of the company's fluxes, chemicals and alloys for through-hole circuit board assembly.
Devine has several years of industry experience. He will be based in the company's global headquarters in Clinton.
Indium is a supplier of electronics assembly materials including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Copyright 2004, UP Media Group. All rights reserved.
UP Media Group Inc. (Atlanta, GA) announced the final conference program and event schedule for PCB Design Conference East 2004—the premier East Coast conference and exhibition for printed circuit board engineering, design and manufacture professionals.
The ninth annual PCB East 2004 will be held at a new venue, the Radisson Hotel Manchester, in Manchester, NH, a location that's central to the New England technology corridor and a short distance from Canada's "Silicon Valley North."
PCB East 2004 features a theme that is extremely relevant and on target for today's PCB designers, engineers and managers: "Education For Your Most Pressing PCB Design Challenges, Including Lead-Free, Embedded Components, High Speed and PCB Design Fundamentals." In fact, more than a third of this year's 36 Professional Development and Technical Conference courses focus on the challenges posed by lead-free printed circuit board design/manufacture/assembly, embedded components and high-speed design.
Additionally, over 80% of this year's courses are new to PCB East, with the rest returning due to popular demand.
"When conference attendees participate in classroom discussions, show floor presentations, networking events and vendor-sponsored activities, they learn about PCB design/manufacture technologies and techniques that they can take back to their employer and share with their coworkers," said UPMG President Pete Waddell. "Participating in a terrific technical conference like PCB East is a win-win situation for everyone involved—our attendees, their companies, and our exhibitors."
PCB East 2004 features a five-day conference program of targeted Professional Development and Technical Conference courses, plus a keynote address, a variety of free special networking events, and a terrific two-day exhibition of the industry's hottest products and services. The three-day technical conference (Oct. 5 - 7) includes 26 short courses—19 of them new to PCB Design Conference East.
Also offered: 10 Professional Development Certificate Program courses, including seven full-day tutorials and three two-day Design Excellence Curriculum courses for which attendees will receive certificates of completion.
The two-day exhibition begins Oct. 5 at 10 a.m.
Registration for the two-day exhibition and most special events is free.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing