UP Media Group Inc. (Atlanta, GA) has announced a call for abstracts for PCB Design Conference East 2004 (PCB East), which will be held Oct. 4-8, 2004, at the Holiday Inn in Manchester, NH. Sponsored by industry trade magazines Printed Circuit Design & Manufacture and Circuits Assembly, PCB East annually provides attendees and vendors with an East Coast conference and exhibition for engineering, design and manufacture professionals.
The five-day conference is made up of a three-day Technical Conference that features short courses and papers, and two days of Professional Development one-day and two-day courses.
Papers and presentations are being sought for the Technical Conference, based on the following course durations: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops or panel sessions, and half-day (3.5 hour) seminars. Papers and presentations also are sought for a Professional Development Curriculum of one-day and two-day tutorials.
Papers and presentations are sought for, but not limited to, the following topics:
- High speed, high frequency and signal integrity
- Impedance and crosstalk control
- EMI/EMC analysis
- Thermal analysis
- RF and microwave
- Packaging and components
- Area arrays
- FPGA design and implementation
- Embedded passives and active devices
- Flexible circuitry
- HDI design and technologies
- PCB design/layout techniques
- Component library creation and management
- Design for manufacture, test and assembly
- Design (including analog, digital and power supplies)
- PCB fabrication
- Soldering (especially lead-free and its impact on design)
- Surface finishes
- Industry forecasts
- Business and design/supply chain issues
To be considered as a speaker or presenter for PCB East, fill out the online submission form or send an email to Conference Chair Andy Shaughnessy, ashaughnessy@upmediagroup.com, by April 5, 2004. Your e-mail should include: a suggested course title, a suggested course length, a short description of your target audience, a 100- to 300-word abstract and a short speaker bio.
Each speaker/presenter will receive a copy of the Technical Conference Proceedings CD-ROM, a free pass for the three-day Technical Conference and free admission to the two-day exhibition, keynote address and other special events.
For more information or to submit a paper and/or presentation online, visit www.pcbeast.com.
UP Media Group (UPMG) specializes in magazine publishing and trade show and conference production. UPMG currently publishes Printed Circuit Design & Manufacture and Circuits Assembly. In addition, UPMG produces two annual conferences and trade shows for the design and manufacture industry—PCB Design Conference West in the San Jose, CA area, and PCB Design Conference East in the Boston area. UPMG also hosts the PCB Road Series of technical seminars in cities throughout the U.S.
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, has published a research priorities document intended to serve as a resource to all who are tasked with directing R&D (both funding and execution) for the electronics manufacturing industry.
"It is only through effective prioritization of limited R&D programs that the North American electronics industry will maintain the technology leadership that it has enjoyed for the past 50 years," said Robert C. Pfahl Jr., vice president of operations for NEMI. "The 2003 NEMI Research Priorities document has been prepared to aid in this process, facilitating more focused investments and an improved rate of return. With a steady stream of research results to harvest, the electronics industry can continue to enjoy growth and prosperity driven by our society's adoption of breakthrough products that increase productivity and improve lifestyles."
The 2003 NEMI Research Priorities, completed at the end of 2003, presents the consensus on R&D needs identified in the 2002 NEMI Roadmap. This document is part of a planning methodology NEMI has established to ensure that its members focus on high-impact areas where they can make a difference in the marketplace. This process involves five basic steps:
"In the past, we have developed a technical plan for our own organization, and we have informally shared information with universities and funding agencies about key areas identified for R&D work," said Pfahl. "This is the first time we have formalized the process and documented research priorities for universities and funding agencies."
The document organizes the R&D needs identified by the roadmap into five categories: 1) manufacturing processes; 2) systems integration; 3) energy; 4) materials and 5) design. Highlights of top priorities identified for each of these areas are as follow:
A final section on disruptive technologies examines how newly discovered phenomena may be exploited to provide innovative technology solutions for identified needs. In particular, this section describes possible future areas for exploiting nanotechnology to create innovative new products.
The document may be downloaded at www.nemi.org.
Milara Inc. (Medfield, MA), a vendor of fully and semiautomatic stencil printers for surface-mount technology and wafer applications, has introduced STW-1, a wafer printer system.
Milara takes its combined system technology practice one step further with the development of the new SemiTouch Wafer Printer system. The system is capable of both wafer stencil printing and bumping within a single system. It is molded after Milara's standard printer but by pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds.
Milara has incorporated a new vision system with accuracies of 12 µm that yields capabilities of ultra-fine-pitch printing. Using patented vibration squeegee technology, which has proven viability in wafer bumping, the system uses the same technology to accomplish ultra-fine pitch-printing (down to 70 µm) with printing reliability (no missed apertures on wafers with excess of 25,000 per print) and solder brick geometry.
Copyright 2004, UP Media Group. All rights reserved.