News
The new Universal Instruments (Binghamton, NY) AdVantis AFC-42 placement machine is designed to reduce the cost of entry for manufacturers needing high mix capability, increased speed and greater accuracy. The machine leverages Universal's platform concept to deliver a low priced but scalable solution ideal for low-margin assembly applications. The machine also has a smaller footprint to occupy less shop floor space.
Like its predecessor, the new machine features a single-beam positioning system. However, it employs dual-drive lead screws as well as 1um linear encoders for accuracy close to that of the GSMxs linear motor based platform.
"All of the capability and functionality of high-end assembly has been transferred to the AFC-42, including high magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, several feeder types and dispensing," said Richard Boulanger, vice president of the advanced semiconductor assembly division.
The company believes the placer will be attractive to high-mix and high-volume manufacturers whose markets demand the utmost cost-per-placement efficiency in order to sustain narrow margins.
Copyright 2004, UP Media Group. All rights reserved.
The National Physical Laboratory (www.npl.co.uk) has announced the launch of a new report, "Susceptibility of Glass-Reinforced Epoxy Laminate to Conductive Anodic Filamentation," written by Alan Brewin, Ling Zou and Christopher Hunt.
Conductive anodic filamentation (CAF) is a subsurface failure mode for woven glass-reinforced laminate (FR4) materials, in which a copper salt filament grows and results in a consequential electrical short between plated through hole walls or adjacent copper planes. In the study, FR4 laminates in the form of high PTH density multi-layer test circuits were exposed to different manufacturing conditions and studied for resistance to CAF initiation and growth.
CAF performance was assessed using high temperature and humidity conditions to promote failures, with a voltage applied across adjacent vias. By applying a range of voltages and via geometries, the basis for a performance map for laminates was obtained for use in materials comparison. The changes due to exposure of laminates to lead-free temperatures and other processing steps were then examined using the technique and a number of important recommendations were made to minimize the possibility of CAF initiation and growth.
All reports released by the Electronics Group at NPL can be searched and downloaded free from: www.npl.co.uk/ei/publications.
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), a global electronics manufacturing services (EMS) company, and Agilent Technologies Inc. (Palo Alto, CA), have announced a new technique for rapidly generating high-resolution, sub-surface 3-D scans of complex multilayer backplane and printed circuit board assemblies (PCBAs).
Using Agilent's 5DX Series 5000 automated x-ray system, the new method verifies how well press-fit connectors with compliant pins are positioned within plated-through-hole (PTH) conduits.
Featuring multilayer construction that can exceed 48 layers, Sanmina-SCI's backplanes deploy high-density, press-fit connectors into PTH conduits with diameters that often measure 0.022 in. and smaller.
Kent Dinkel, Agilent's Imaging marketing manager, Automated Test Group, said, "Our 5DX system was designed to be a powerful x-ray tester always looking for new problems to solve. We salute Sanmina-SCI for galvanizing an application that has enabled the industry's first sub-surface 3-D scans of complex backplanes in production environments."
Dinkel also noted that press-fit connectors having compliant pins are becoming more widely used in a number of PCBA markets.
Sanmina-SCI noted that when multiple component types, including surface-mount devices, populate a backplane or PCBA, the new inspection method can scan the entire backplane—both surface and sub-surface simultaneously—to check solder contacts of components as well as press-fit connector contact integrity.
Copyright 2004, UP Media Group. All rights reserved
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