News
The Christopher Group (Santa Ana, CA) will be exhibiting the NSpec Fv 20 large format automatic optical inspection (AOI) system for printed circuit board (PCB) assembly applications at IPC APEX in Anaheim, CA, on Feb. 24-26.
The NSpec Fv series systems are used in 2-D solder paste, pre reflow and post reflow applications and can inspect panels up to 20 in. x 26 in.. Optional features include off line programming, off line verification/repair stations and line monitoring and control software. Bench top and in line systems are fully compatible, and all systems include an 18-month warranty.
Other systems to be exhibited include the SmartOptics S8M 3-D solder paste inspection system, HC 610 PCB hole inspection system, SynPower PCB measurement/inspection system and Koki solder pastes and wave soldering fluxes.
Copyright 2004, UP Media Group. All rights reserved.
Transition Automation (North Billerica, MA) recently introduced the newest product in the Board-Lok tooling family: the Flex-Kit™ Board Support System. This product supports bare surface-mount boards when they are passed through the printing machine.
The system gives support over a range of board sizes from 2.5 in. to 17 in. wide. The kit is supplied with four sections that may be set side by side in various widths, which provides 15 possible combinations.
The system gives nearly full area support for varying product widths, which allows for better process parameters such as cycle speed and print accuracy.
Ergonomics and electrostatic discharge (ESD) protection are central to the product design. Support elements are lightweight, rugged and visible. Magnets and optional tooling pins secure the system into position. Each of the different sections of the system is able to nest within one another.
The National Electronics Manufacturing Initiative (NEMI, Herndon,VA), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, will kick off its 2004 roadmap March 24-25. NEMI member Sun Microsystems will host the meeting at their facility in Newark, CA.
"The kick-off meeting gives all of the committees and groups who are developing individual chapters of the roadmap a chance to meet together as a whole to discuss the ‘big picture' and coordinate on the issues that affect all aspects of the roadmap," said Jim Arnold, fellow of the technical staff for Motorola and NEMI's director of roadmapping. "It's a very useful and productive session that catalyzes the six-month process."
Every two years, NEMI maps the future manufacturing needs of the global electronics industry in order to identify the key technology and infrastructure developments required to assure leadership of the supply chain over the next decade. It helps companies anticipate shifts in product requirements and provides an early warning of changes in technology or infrastructure.
2004 marks the tenth anniversary of this highly successful initiative. The first roadmap was created in 1994 by the National Electronics Manufacturing Framework Committee, a group of 200 individuals from industry, government and academia who came together to study the challenges facing the nation in electronics manufacturing, and to develop technology roadmaps and policy options with which to address these challenges.
Since that time, the roadmap has served as the foundation of all NEMI activities. NEMI uses the roadmap's forecasts to identify critical technology and infrastructure gaps, prioritize R&D needs to meet these gaps, and initiate activities to address industry needs.
NEMI is currently recruiting industry experts to participate in the 2004 roadmap (NEMI membership is not required for participation).
Anyone interested in getting involved with the NEMI roadmap should contact Chuck Richardson, NEMI staff manager of roadmapping, (256) 880-0922; email: Chuck.Richardson@NEMI.org.
Copyright 2004, UP Media Group. All rights reserved.
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