News
AMTECH Inc. (Branford, CT), a supplier of solder powders, pastes, fluxes and associated products used in electronic assemblies, has introduced NoVOC™, a water-based, no-clean liquid flux for use in wave soldering.
The low solids liquid flux contains no rosins, resins or volatile organic compounds (VOCs). It improves solder joint reliability and reduces the risk of rework since it leaves no insulating residue on test pads or conductive pads. The no-clean formula eliminates the need for wash-up, since any residual flux residues are non-corrosive and halide-free.
The flux features low surface tension, for wetting prior to wave soldering double sided or multi-layer boards. It is ideal for board assemblies containing sensitive sliding switches or conductive carbon pads.
With water as the main ingredient, the flux is inherently more economical to manufacture than rosin-based fluxes. As a non-hazardous material, it easily transported and contains no irritants.
The flux is available in 1, 5 and 55 gallon containers. It can be applied by spraying or dipping and can be diluted when required by using deionized water.
Copyright 2004, UP Media Group. All rights reserved.
Shoda Techtron Ltd. (Hamamatsu, Japan), a manufacturer of printed circuit scoring, beveling and shear/beveling systems, announced that it has entered into a sales and service agency agreement with Christopher Group Inc. (Santa Ana, CA) for distribution of their complete product range of products in the North American market.
Shoda has also announced the introduction of the ACS-1500NC III automatic laminate cutting saw, developed for materials to .002 inches in thickness, and the IT-700HA automatic printed circuit board (PCB) thickness measurement system. The system was developed to accurately measure thickness of PCBs for controlled impedance applications.
Shoda has installed over 1,500 systems worldwide, while Christopher provides distribution and engineering support focused on the North American market.
Copyright 2004, UP Media Group. All rights reserved.
Universal Instruments (Binhamton, NY) has trimmed the footprint and increased the maximum board size for its high-speed placement platform. According to the company, the result is more flexibility in a smaller shop-floor space. The new 4797R HSP accepts up to 96 feeders with placement speed maintained at 48,000 cph.
The machine is capable of handling boards up to 610 mm (24 in.) x 460 mm (18 in.) within a footprint machine measuring 3,100 mm (122 in.) x 2,155 mm (84.8 in.). Three-sigma accuracy is 0.08 mm for MELFs and small chips and 0.05 mm for leaded components.
Accepting up to 72 components on standard 8 mm tape feeders, or 96 components with dual-track feeders, the machine has a minimum placement tact time of 0.075 seconds. Feeder axis tact time is 0.09 seconds or 0.08 seconds with the dual-track feeder.
Standard equipment includes 12 five-spindle, advanced direct-drive placement heads and Universal's software for offline programming. Available options include component library data teach, pattern program data teach, barcode validation system (BVS), traceability package, ball grid array (BGA)/ chip scale package (CSP) recognition, and GEM/SECS II.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- Saki to Highlight Advanced Inspection Innovation at 39th Nepcon Japan
- ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
- NCMS Releases White Paper: “Artificial Intelligence to Improve Supply Chain Resilience Throughout American Manufacturing”
- E-tronix Expands Team with Strategic Hires to Strengthen Technical Solutions Support in 2025