News
Nacom Corp. (Griffin, GA), an automotive electronic comonents provider, has been named "Large Manufacturer of the Year" for the state of Georgia. Company representatives accepted the award last week from Gov. Sonny Perdue at a gala celebration serving as the capstone of Manufacturing Appreciation Week. Perdue cited Nacom for the part it has played in both the local and state economies.
Satoshi Negishi, the chairman of the board of Nacom's parent corporation, the Yazaki Group (Tokyo, Japan); John Olson, the vice president and general manager of Nacom; and Mary Goggins, Nacom's 2003 Associate of the Year recipient, were on hand to accept the award.
Olson praised NACOM's employees and cited the grassroots level assistance the firm has received from the Griffin community, the volunteer effort employees have demonstrated within their community and the close working relationship with Griffin Technical College.
NACOM opened its operation in Griffin in 1994 and expanded in 1997 to encompass almost 500,000 sq. ft. of manufacturing space and employ over 900 associates.
Copyright 2004, UP Media Group. All rights reserved.
Indium
Corp. (Utica, NY) offers a complete range of solder preforms for
interconnect and joining applications. The company's product line
includes their range of solder alloys, as well as a capability to
produce numerous sizes and shapes.
Indium, a supplier of
solder fabrications, offers solder preforms in a variety of shapes,
including: washers, discs, rectangles and squares, "picture frames",
shot, spheres, ganged arrays and specialty shapes.
Solder
preforms are produced in a wide size range. Discs are made with
diameters as small as 0.004 in.. Washers are made with inner diameters
as small as 0.015 in. and outer diameters as small as 0.025 in. All
preforms can also be produced in larger sizes.
Solder preforms
can be specified in most of the nearly 300 alloys offered by the
company, including lead free. In addition, many preforms offer the
option of flux-coating. Solder preforms are packed with a variety of
options including: jar, tray, palette and tape and reel.
www.indium.com
Copyright 2004, UP Media Group. All rights reserved.
Speedline
Technologies Inc. (Franklin, MA), announced it has entered into an
exclusive agreement with the Georgia Institute of Technology (Georgia
Tech, Atlanta, GA) for the license of patent-pending closed-loop
printing technology. The intellectual property facilitates the closing
of the loop between an automated optical inspection (AOI) system and a
printer with the intent to optimize the volume of printed paste
deposits.
"The agreement governs the terms for commercial
development of this intellectual property for ultimate product sale,"
said Robert Boyes, product marketing manager, Speedline Technologies.
"We are honored to join with Georgia Tech to develop product
technologies that will generate profound benefits for printed circuit
board manufacturers. The goal of this partnership is to advance process
control technology for the printing
process, which will ultimately provide improved yield opportunities for customers."
The
closed-loop printing technology was developed by Georgia Tech at the
Center for Board Assembly Research (CBAR). Recent proof of concept
testing conducted at Speedline validated Georgia Tech's findings. The
technology embodies algorithms that utilize hybrid data-driven control
techniques for calculating independent variable modifications. This
effectively changes machine parameters in real time and improves
process yields and product reliability.
"Data-driven
closed loop control is essential for electronics manufacturing
industry," said Alex Goldstein, director of operations and
infrastructure at CBAR. "With help from the industry, CBAR will
continue this work for different processes in electronics
manufacturing."
Georgia Tech recognized Speedline as a valued CBAR partner at APEX 2004 in
February in Anaheim, CA.
www.speedlinetech.com
Copyright 2004, UP Media Group. All rights reserved.
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