News
FEINFOCUS (Stamford, CT) has introduced the COUGAR-VXP (Versatile X-ray Platform), a new modular x-ray inspection platform for maximum operator flexibility. The new platform addresses a broad range of inspection requirements throughout the industry, from basic failure analysis to high-end inspection for SMT production. The COUGAR-VXP was developed as a versatile X-ray inspection solution to constantly changing market and application requirements in the worldwide electronics industries.
The basic platform provides for further equipment and accessory implementation, depending on the particular needs of the customer. The initial configuration includes a standard microfocus x-ray tube up to 160 kV, true x-ray intensity (TXI) Control, a standard four-axes manipulator, an advanced realtime image processing system and a standard realtime image chain with high-resolution 4 in. image intensifier and flat-screen monitor.
Users also have the option of adding features such as a more sophisticated manipulator system, CNC capability, higher-bit image chain, direct digital detector (DDD) and a multifocus x-ray tube up to 160 kV.
The platform features a small footprint (approximately 1 x 1 m); low system weight (approximately 1.450kg); and convenient front and side door service access.
An advanced surface-mount configuration is also available, featuring a higher-bit image chain with 16-bit realtime image processing, CNC capability, digital detector, and oblique viewing capability with AIM technology.
Copyright 2004, UP Media Group. All rights reserved.
The Metcal (Menlo Park, CA) division of OK International has developed a flexible optical inspection system for use with large boards measuring up to 36 x 36 in. The VPI-1000-XL system is the latest addition to the company's range of optical inspection systems for inspection of array packages and surface-mount devices.
The system meets all inspection requirements on larger boards, which are becoming increasingly common in applications such as cellular base stations, data communications and network servers. It features four adjustable supports to hold round, rectangular, square or l-shaped printed circuit boards (PCBs) and has an articulating arm capable of spanning up to 24in., allowing it to cover a 36 x 36 in. board without requiring a lens change.
Metcal's NovaScope lens design is capable of moving through 90° left/right and 20° up/down, so operators can inspect under array packages with standoff heights as low as 0.002 in. (0.05 mm) and clearances of just 0.043 in. (1.1 mm) between components. The optical design is sharper and clearer - using 2/3 fewer optical elements to send a direct image to the high-resolution CCD camera.
The integrated optical design is a departure that moves beyond typical endoscopic systems and gradient lenses. While conventional designs relay an internal image repeated throughout the length of the endoscope, an approach requiring multiple sets of complex optical elements to perform the task, NovaScope has only one image: the image in front of the eyepiece.
In operation, the system floods the underside of a component with bright white metal halide light that replicates natural daylight, enhances the color rendering and produces images on the system's color LCD monitor. The lens looks underneath array packages to inspect each ball and its top and bottom connections. With a quick turn of the lens adjustment ring, operators can move through the underside of the device to check for defects such as bridging, cold solder joints, open circuits, excess flux, contamination and other process-related failures.
The unit can also be used for inspecting surface-mount devices and any other board feature without changing lenses. Apertures on stencils can also be inspected with ease.
A software tool completes the package, allowing users to measure, record, annotate, analyze and communicate component information. Images are displayed in real-time for a visual inspection of the soldering process, and they can be captured and stored for future reference or reports. Documents can also be emailed or archived for use in training, research and development or quality insurance.
Copyright 2004, UP Media Group. All rights reserved.
The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA, Arlington, VA) continued its slow upward movement in March, creating hopes that profits will follow.
"We're continuing to see a gentle increase that is consistent with our conversations with manufacturing executives," said Bob Willis, ECA president. "The prevailing hope from manufacturers is that average selling price (ASP) will begin to rise in concert with sales."
According to Willis, manufacturers are reporting some isolated supply shortages, which could spur demand and raise ASPs. Recently, UBS Securities reported that multi-layer chip capacitor (MLCC) supply is expected to fall short of demand in the second half of 2004, which could create a 5 to 15% price increase. In other areas, however, even substantial growth will not ease price pressures. Market researcher IDC predicts a compound annual growth rate of 15% for LCD panels between 2003 and 2007, with 56% growth in 2004 alone. But, IDC predicts the market will be oversaturated during that period, leading to price erosion.
The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services. It is a sector of the Electronic Industries Alliance (EIA), comprising more than 2,100 members that reportedly represent 80% of the $430 billion U.S. electronics industry.
Copyright 2004, UP Media Group. All rights reserved.
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