News
Agilent Technologies Inc. (Palo Alto, CA) recently introduced its Versatest Series Model V5400. The system includes a dynamic algorithmic pattern generator (APG) and patented tester-per-site (TPS) architecture, which provide configuration flexibility and throughput improvement for wafer sort and final memory testing.
Compatible with the company's Versatest Series Model V4400, the Model V5400 overcomes the challenge of testing standard and stacked memory modules such as flash, DRAM and SRAM while offering up to 4,608 channels and 144 independent test sites. The increased performance and lower system costs helps reduce the overall cost of test for semiconductor contract manufacturers, fabless design houses and memory integrated device manufacturers.
The growing consumer demand for digital devices with added functionality and smaller footprints at lower prices has given rise to new test challenges. The devices require higher frequency test systems and the flexibility to test multiple types of memory such as flash and DRAM concurrently, while continuing to require a lower cost of test. Until now, memory manufacturers have purchased separate systems for testing the different kinds of memory embedded in handheld consumer devices. The system's single, scalable platform architecture will allow users to test standard memories, reduced pin-count devices, BIST-enabled devices and stacked memories at up to four times higher throughput compared to existing systems.
The TPS architecture allows each device under test (DUT) to receive its own set of tester resources. Dynamic APG can independently test up to four low-pin-count DUTs per site module. For complex tests or high pin count devices, dynamic APG can reallocate all site module resources toward testing a single DUT. Configurable solely through software, the dynamic APG enables the system to test a broad spectrum of devices without a change in tester hardware.
Complementing the flexibility of dynamic APG is the parallelism offered by the testhead. The system with 4608 I/O pins can asynchronously test up to 144 independent devices.
www.agilent.com/see/memorytest
UP Media Group and Circuits Assembly, the premier magazine serving the printed circuit board (PCB) and electronics assembly marketplace, today named Mike Buetow as editor-in-chief. He replaces Lisa Hamburg Bastin, who has resigned to take a position outside the industry. The appointment is effective July 16.
Buetow is currently editor-in-chief of Printed Circuit Design & Manufacture, a UP Media Group publication, for which he has overseen all editorial and production aspects for five years. He has more than 13 years of experience in the electronics industry, including six years at electronics trade association IPC, at which he was a technical projects manager and communications director. Buetow is very familiar with the surface-mount and electronics assembly industry, previously holding editorial positions at SMT Magazine. He is a graduate of the University of Illinois.
"Having begun my career covering the SMT industry, and having worked on standards on soldering and components, I feel like I'm coming home," stated Buetow. "I look forward to assuming the lead on the world's best magazine for electronics assembly."
Hamburg Bastin led Circuits Assembly for over six years as editor-in-chief. She leaves to become editor of the National Maritime Center's publications branch. The Arlington, VA, based NMC is a Coast Guard Headquarters field unit established to promote marine safety, environmental protection and security.
"Circuits Assembly is in a very strong position to capitalize on the currently improving electronics manufacturing landscape," stated Hamburg Bastin. "Our editorial mission has always been simple: to educate assemblers about current technologies and to prepare them for future changes in packages and assembly/attachment methods. With exciting changes on the horizon such as lead free, the continuing growth in outsourcing and the narrowing barrier between back-end semiconductor manufacturing and PCB assembly, Circuits Assembly will maintain its dedication to leading-edge, award-winning editorial under the helm of Mike Buetow. I leave the magazine in the very best of hands."
Andy Shaughnessy, currently associate editor at PCD&M, has been promoted to editor of that magazine effective July 16. Shaughnessy will be working closely with publisher Pete Waddell.
"It has been my pleasure and honor to work with Lisa for over 10 years," stated Waddell. "During that time I have been impressed by her talent, her dedication and growth. I know that she will succeed in her new position, and the industry will miss her.
"On the other hand, I have every confidence in Mike and Andy," continued Waddell. "They have both proven very skillful at taking the pulse of the markets we serve, not only reporting on these markets, but providing a leadership role as well. Our culture at UP Media Group has always been to promote from within when the situation presents itself and seems logical. With Mike assuming the helm of Circuits Assembly and Andy being promoted at PCD&M, we're putting that internal policy to the best of use."
About Circuits Assembly
Circuits Assembly is the premier, award-winning magazine exclusively serving the PCB and electronics assembly marketplace. It focuses on the entire assembly process and business, including surface-mount/mixed-technology; HDI/back-end semiconductor manufacturing; component placement; screen printing; soldering; rework; test/inspection; materials; process control; data management; advanced component packaging; emerging technologies, plus much more. Circuits Assembly and its email newsletter, www.pcbupdate.com, are free to qualified professionals. Visit www.circuitsassembly.com for more information.
About UP Media Group Inc.
Headquartered in Atlanta, GA, UP Media Group (UPMG) is a privately held company that specializes in magazine publishing and trade show and conference production. UPMG currently publishes two high-tech magazines: Printed Circuit Design & Manufacture (www.pcdandm.com) and Circuits Assembly (www.circuitsassembly.com). In addition, UPMG produces two annual conferences and trade shows for the design and manufacture industry—PCB Design Conference West (www.pcbwest.com) in the Silicon Valley area, and PCB Design Conference East (www.pcbeast.com) in the New England area. UPMG also hosts the PCB Design Conference Road Series (www.pcbshows.com) of courses in cities throughout the U.S.
The CLM9000plus from ESSEMTEC (Glassboro, NJ) is based on a new software and hardware platform. The mechanical improvements include a complete new drive system which results in 20% placement speed increase, as well as improved accuracy and repeatability. Improved bearings result in longer lifetime and less wear. A newly available calibration set that includes glass plates and components allows customers to verify on-site the accuracy of the machine if needed for ISO9000 protocols.
The software is based on the Easyplacer plattform and includes new possibilities to run complete sets of boards or place single boards in multiple boards in any angle in the machine. Automatic height detection of the feeders is now integrated and the software includes an improved link to the management information system software that optimizes the production and keeps track of components and production data.
The integrated vision system from Cognex accurately locates fiducials marks, but also allows to placement beside micro ball grid arrays (BGAs), BGAs, fine pitch components and odd-shape components.
The bad mark sensing option excludes boards automatically from placement or dispensing. Free definable marks can be taught and verified. The new multi field of view option centers and inspects components up to 65 x 65 mm.
Up to 190 feeders with LED indication can be mounted and are now directly linked with ESSEMTEC's MIS system to load/reload components while the machine is placing. The machine can be equipped with a bar code-based set up control to eliminate possible set up errors.
Copyright 2004, UP Media Group. All rights reserved.
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