News
NEPCON Shanghai/Electronics Manufacturing Technology China (EMT China) will be held April 26-29 at the Shanghai Everbright Convention & Exhibition Centre. The Surface Mount Technology Association (SMTA) and the Electronics & Information Industry Sub-Council (CCPIT) of China are co-organizing the high-level surface-mount technology conference.
This year's program will consist of a keynote, technical sessions on lead-free technology and 0201 assembly and two half-day training courses on lead-free systems by industry expert and past SMTA president Dr. Jennie S. Hwang, H-Technologies Group Inc.
The Keynote and technical presentations will be given by the Ministry of Information Industry, Gartner Dataquest, Flextronics International, Indium Corp., ERSA, HITACHI, Kingston Technology Co., EKRA, Daiichi Jisugyo, Fuji, OK Interenational, Siemens Dematic and Solectron.
The first training course, Interconnection Technology and Printed Circuit Board (PCB) Surface Finish and Component Coating is intended to provide broad-based information that enhances technology foundation in preparation for lead-free implementation. The presentation will be comprised of two parts: the first will cover lead-free solder interconnections and the second will address the properties and performance of lead-free PCB surface finishes and the component lead coatings.
The second course, Manufacturing Implementation, will focus on achieving yield, quality and reliability. The course will examine the key process modules, including solder paste printing and reflow, and the system compatibility between the BGA/CSP solder sphere, assembly solder paste, component coating and PCB substrate surface finish.
http://www.smta.org/education/symposia/symposia.cfm#nepcon_shanghai
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) has issued a set of interim recommendations for lead-free component finishes to be used in high-reliability electronic applications to minimize the risk of failures caused by tin whiskers. These recommendations were developed by the consortium's Tin Whisker User Group, comprised of nine large manufacturers of high-reliability electronic assemblies that annually purchase millions of dollars of components.
The group was organized to define methods and tests that would minimize the probability of tin whiskers creating functional or reliability problems in their products. Members include Alcatel, Celestica, Cisco Systems, Delphi Electronics, HP, IBM, Lucent Technologies, Sun Microsystems and Tyco Electronics. The group consensus is that pure tin electroplating presents a risk in high-reliability applications, and they have outlined cost-effective alternatives—using known mitigation practices and some level of testing—to minimize this risk.
This second interim report updates a report published by the group in June 2003 and presents recommendations for lead-free finishes for a variety of applications. These recommendations reflect the best judgment of the group members, based on their own experiences and the available data. The document outlines specific whisker mitigation guidelines supported by the group.
The document also discusses specific component types, assessing the reliability risk of tin whiskers for each and the various mitigation strategies recommended. The group is currently in the process of extending this work to create a user acceptance specification based on the test methods defined by the NEMI Tin Whisker Accelerated Test Project.
The Tin Whisker User Group's recommendations are available at: http://www.nemi.org/projects/ese/tin_whisker_usergroup.html.
Copyright 2004, UP Media Group. All rights reserved.
Data I/O Corp. (Redmond, WA), a provider of manual and automated programming systems, announced high volume programming support for Texas Instruments' (TI, Dallas, TX) TMS320F2810 digital signal controller on its Sprint family of device programmers. With this support, TI's automotive, white goods and industrial customers have a programming solution for the flash-based F2810 controller along with the already supported TMS320F2812 controller.
Jennifer Skinner-Gray, TMS320C2000T marketing manager, Texas Instruments, said, "TI continues to work closely with Data I/O to assure that our customers using Data I/O manual and automated programming systems have volume programming support for new C2000 controllers as they become available."
The 32-bit digital signal controllers are digital signal processing (DSP)-based cores optimized for control applications that require the peripheral set and ease-of-use of a microcontroller (MCU). The result is a highly integrated system on chip (SoC)-like device that is able to handle control system processing requirements, as well as replace control system host MCUs.
"We are pleased to announce this support for the F2810," said Bruce Rodgers, Data I/O Director of Semiconductor Relations & Marketing. "The automotive market is an important customer group for our company, and we expect many users will embrace this family of TI devices for their range of applications."
Copyright 2004, UP Media Group. All rights reserved.
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