Cookson Electronics Assembly Materials (CEAM, Jersey City, NY) has introduced a new dulling flux technology, ALPHA EF-9301. The product is compatible with both tin/lead and lead-free processes and is designed to help manufacturers meet environmental regulations without sacrificing productivity.

Tested under real-world conditions, the flux was shown to deliver higher first pass yields, more throughputs and require less rework than competitors. It reduces bridging on connectors and bottom side components and provides superior hole filling. Additionally, it minimizes solderballing, significantly reducing board handling time. The flux creates smooth, fully dull solder joints, easing the visual inspection process. It is designed for both spray and foam applications, eliminating the need for investment in additional equipment.

CEAM has also announced the worldwide availability of ALPHA OM-338, an ultra fine lead-free solder paste. The no-clean solder paste is designed for a broad range of applications and is formulated to minimize the transition concerns from tin/lead to lead-free processes. It yields print capability performance across various board designs and is ideally suited for ultra fine feature and high throughput applications.

The paste provides voiding resistance and maximizes reflow yields across a range of thermal profiles. Full alloy coalescence can be achieved at circular dimensions as small as 0.25 mm. Use of the paste results in print consistency and rapid cycle times. It can be applied at print speeds of up to 200 mm/sec. The high performance of the solder paste increases plant efficiency, increases yield and reduces rework requirements. It meets the highest IPC voiding performance classification and is reliable, ensuring product longevity. The paste is halide-free and compatible with either nitrogen or air reflow processing.

CEAM has also introduced ALPHA Vaculoy SACX307 lead-free wave solder alloy, which will be available worldwide through Cookson's global distribution network. The alloy delivers high yield and fast throughput, while meeting the strict lead-free environmental mandates.

Its fast wetting speed delivers improved solderability, outperforming all Sn/Cu based alloys. It provides excellent drainage and minimizes bridging defects. The alloy creates strong, mechanically sound joints with long-term reliability. The solder minimizes dross generation, resulting in low process maintenance and reduced product waste.

The process window supports the use of a wide range of flux technologies.

CEAM, a Cookson Electronics company, develops, manufactures and sells materials used in the electronics assembly process. CEAM supplies a full line of solder paste, stencils, squeegee blades, stencil and printed circuit board (PCB) cleaners, bar solder, cored wire solder, wave soldering fluxes and surface-mount device adhesives.

www.alphametals.com

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