News
Dow Corning Corp. (Midland, MI) has expanded its base of thermal management solutions for the electronics industry by introducing three new thermal interface materials (TIMs). Two of the new materials—TP-1600 film series and TP-2400 pad series—are the first fabricated TIMs to emerge from Dow Corning following its acquisition of Tyco Electronics' Raychem Power Materials Business Unit last year.
The thermally conductive films and pads help customers improve thermal dissipation in electronic components and assemblies and are designed for ease of use and process flexibility. Because they are pre-cured, the fabricated TIMs do not require special application tools, are re-workable and are available in a range of thicknesses. They are suited for electronics applications in the automotive, display, computer and power markets.
For similar heat management needs in high-powered CPU applications, the company has introduced TC-5021, a thermally conductive grease. As a wet-dispensed material, the grease enables customers to achieve thin bond lines and can be used in high-volume automated manufacturing environments.
Dow Corning's newest fabricated and wet-dispensed materials are part of the company's growth strategy in the TIMs market, which, according to electronics industry market research firm Prismark, is expected to more than double to $419 million by 2007, up from $170 million in 2002. The market expansion is driven by a growing need to control heat and electrical resistance in electronics devices. As these devices get smaller, faster and less expensive, electronics manufacturers need a broad selection of thermal management solutions to help them address a dynamic range of process needs.
www.dowcorning.com/electronics
Copyright 2004, UP Media Group. All rights reserved.
The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA, Arlington, VA) continued its upward movement in February, extending an industry comeback that began last fall. ECA's 12-month moving index is up nearly 10 points in the last six months after being flat for much of the first half of last year.
"All signs continue to be positive," said Bob Willis, ECA president. "One of the trends ECA watches is participation in upcoming industry events. These are the forums where the industry should be actively exchanging information and taking advantage of business opportunities."
ECA has a full slate of industry conferences coming up where it can gauge industry momentum, beginning with CARTS 2004, the passive component technology conference and exposition, in San Antonio, TX. Other events in the ECA line-up include the International Relay Conference (IRC), the Electronic Distribution Show (EDS), the Electronic Components and Technology Conference (ECTC), CARTS Europe and the International Wire and Cable Symposium (IWCS).
The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services. It is a sector of the Electronic Industries Alliance (EIA), comprising more than 2,100 members that reportedly represent 80% of the $430 billion U.S. electronics industry.
Copyright 2004, UP Media Group. All rights reserved.
Celestica Inc. (Toronto, Ontario, Canada), an electronics manufacturing services (EMS) provider, has completed its acquisition of Manufacturers' Services Limited (MSL, Concord, MA), a full-service global electronics manufacturing services and supply chain services company.
Pursuant to the merger agreement, in consideration for the acquisition, Celestica will issue to holders of MSL common stock and certain holders of MSL preferred stock approximately 14.3 million subordinate voting shares and will pay cash consideration to certain MSL preferred stock holders totaling approximately $50.6 million.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing