TOKYO – Global sales of semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a new high of $103 billion in 2021, surging 44.7% from the previous industry record of $71 billion in 2020, SEMI said.
TAMPERE, FINLAND – The first system on chip developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The chip will be ready for deployment in early 2022. The Ballast chip is the first in a series of three chips. TSMC will manufacture it.
TOULOUSE, FRANCE – Latécoère has entered into a definitive agreement to acquire electronics manufacturer Malaga Aerospace, Defense & Electronics Systems for an undisclosed sum.