News
ATLANTA, GA – Printed circuit engineers are ready to get back to face-to-face events, and the PCB West technical conference has all the reasons they need to make their return to live interaction more than worth their time. Registrants who sign up before September 7 can take advantage of the Early Bird Special discounts for the conference, which features 40 presentations spanning more than 120 hours of classroom time.
WASHINGTON – Face-to-face meetings have been scarce in the past year, but historically even rarer have been sessions between US electronics industry leaders and their counterparts in the US Department of Defense.
Panel Level Packaging Consortium Investigates Warpage, Die Shift in Large Format Reconfigured Panels
BERLIN – The second incarnation of a panel level packaging consortium, PLC 2.0, investigated warpage and die shift in large format reconfigured panels (18" x 24"), and considerable progress has been made toward understanding the root causes. With these insights, the relevant parameters can now be controlled better to enable large-area fine-line RDL processes. The analytical effort has paid off, as RDL could be scaled down considerably on the panel level, making the most of the advantages of both wafer and panel-level technologies and paving the way for an entirely new process chain with new equipment and materials.
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S