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FRAMINGHAM, MA – Worldwide smartphone assembly shipment volumes in the second quarter were up 11.9% sequentially, with total shipments of 332.6 million, according to International Data Corp.

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AUSTIN, TX – Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing, according to TechSearch International.

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BATANGAS, PHILIPPINES – Cal-Comp Technology expects to raise P8.805 billion (US$171.7 million) from its planned IPO this year.

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