News
DALLAS – StenTech and BlueRing Stencils today announced a strategic merger, bringing together two of the leading suppliers of stencils for printed circuit board assembly.
ATLANTA – The electronic component sales outlook was stable in March and is expected to remain so during the current month, according to the ECIA’s monthly survey of passive component vendors.
TAIPEI – TrendForce has reduced its 2025 notebook brand shipment growth forecast from 3.6% to just 1.4%, citing continued economic headwinds and uncertainty over tariff policy. The downgrade comes despite a 90-day US grace period before reciprocal tariffs take effect.
Press Releases
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
- TTCI Expands Southeastern U.S. Presence Through Partnership with Microwave Component Sources; Bert Horner and Ryan Peavey Comment
- Essemtec Expands US Presence with New, Larger Demo Lab in Burlington, MA; Don Jeka Comments
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