MALAYSIA – Scanfil has officially inaugurated the expansion and modernization of its Johor Bahru facility in Malaysia, building its electronics and complex box-build manufacturing capabilities. The EUR 4.3 million investment, first announced in January, expands production space by nearly 50% and enhances efficiency, quality and capacity.
BENGALURU – Syrma SGS Technology has signed a joint venture agreement with Italy-based Elemaster to form Syrma SGS Elemaster Private Limited, an India-focused platform serving high-reliability customers in railway, industrial and medical electronics. The JV’s initial ~20,000 sq. ft. facility in Bommasandra Industrial Area, Bengaluru will be configured for SMT, THT and box-build assembly lines.
PEACHTREE CITY, GA – The exhibition floor space is sold out for PCB West, the largest exhibition and conference for printed circuit board design, fabrication and assembly in the Silicon Valley, Printed Circuit Engineering Association (PCEA) said today. It is the 11th time in 12 years all booths have been sold for the popular exhibition.