News
MILPITAS, CA – SEMI FlexTech announced new projects featuring novel interconnect and integration strategies to move innovations to market-ready products. The projects include thin batteries, printed audio speaker systems, and flexible fan-out wafer-level packaging advances.
TAOYUAN CITY, TAIWAN – Taiwan Printed Circuit Association and five local government bodies signed a declaration for the perseverance and safety of the PCB industry. The plan is for mutual integration of resources and enhancement of security, and the development of international safety standards with a goal of zero disasters.
TAIPEI – PC DRAM pricing dropped precipitously in the first quarter as quarterly contracts gave way to monthly deals.
Press Releases
- 2026 IEEE Electronic Components and Technology Conference Student Innovation Challenge Pre-registration Deadline Extended to January 11, 2026
- PCBsync PCB Assembly Introduces Full-Scale Electronic Manufacturing Service
- Magic Leap Partners with Pegatron for AR Glasses Components Production
- TEXMAC/Takaya Appoints ARK Mfg. as New Rep in Arizona