News
ATLANTA, GA – The exhibition floor is sold out for PCB West, the largest conference and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley, UP Media Group Inc. said today. It is the earliest in the show’s 28-year history that all booth space has been reserved.
AUSTIN, TX – Power devices are experiencing growth, with overall lead-frame package shipments expected to increase 4.3% from 2017 to 2021, with stronger growth projected for Cu clip packages, according to TechSearch International.
MOUNT PLEASANT, WI – The first round of Foxconn’s Smart Cities, Smart Futures competition prompted 325 entries from students, faculty and staff at higher education institutions in Wisconsin.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing