News
BANNOCKBURN, IL — Lars Bruno, Ericsson AB, won best technical conference paper of IPC Apex Expo for “Rework of New High Speed Press Fit Connectors.”
SHANGHAI - Lenovo today announced a new patent-pending low temperature solder process developed to improve PC manufacturing by conserving energy and increasing reliability.
BEDFORD, UK -- The UK SMART Group will release a new guide to solderable finishes and their defects in the next month.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing