SAN JOSE, CA – Ahead of its acquisition of Broadcom, Avago is selling its optical module unit to Foxconn for an undisclosed sum.
LYON, FRANCE – The volume of devices packaged using flip chip technology will double from 16 million wafers per year in 2014 to 32 million wafers per year in 2020, reaching $25 billion, says Yole Développement.
MONTERREY, MEXICO – Nortech Systems has launched printed circuit board assembly manufacturing at its facility here.