News
SAN JOSE, CA – Ahead of its acquisition of Broadcom, Avago is selling its optical module unit to Foxconn for an undisclosed sum.
LYON, FRANCE – The volume of devices packaged using flip chip technology will double from 16 million wafers per year in 2014 to 32 million wafers per year in 2020, reaching $25 billion, says Yole Développement.
MONTERREY, MEXICO – Nortech Systems has launched printed circuit board assembly manufacturing at its facility here.
Press Releases
- Libra Industries Appoints Robert Hermann as Chief Operating Officer
- AIM Solder Signs New Distributor for Long Island Region
- Altus Strengthens its Partnership with Active-PCB Solutions Through Further Investment in Koh Young Technology
- Data I/O Announces CEO Transition Plan: Industry Veteran Bill Wentworth to Lead Company