News
LAS VEGAS -- Work on the latest revision to the industry standard for soldered electrical and electronic assemblies has begun, with the task group focused on vertical solder fill for Class 2 product and BGA voiding, among other topics.
HANOI -- Samsung Electronics will invest $300 million in a new research and development project here in exchange for free rent.
TAIPEI -- Foxconn will hold a scheduled board meeting this week as its deal to acquire Sharp continues to twist and turn in the financial wind.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing