News
LYON, FRANCE – The fan-out wafer level packaging market reached more than $150 million in 2014, and a CAGR of 30% for the next five years is expected, says Yole Developpement.
SCHAUMBURG, IL -- Sparton today said fiscal third quarter sales at its Manufacturing and Design Services unit rose 3.6% to $62.2 million.
LISLE, IL -- Molex today announced the acquisition of certain assets of Soligie, a provider of printed and flexible electronics for various end-markets.
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S