News
HIGH WYCOMBE, BUCKS, UK – The Smart Group will present a 60-minute webinar on using solder spheres in fine-pitch area array rework on Aug. 20.
BANNOCKBURN, IL — Columnist, author and small business owner Gene Marks will keynote at the IPC Technology Market Research Conference (TMRC) in late September in Chicago. The keynote, themed “The Next Generation: Creating the Electronics Industry of the Future,” will be held Sept. 24; the TMRC meeting takes place the next day.
BANNOCKBURN, IL – IPC issued a call for awards nominations to recognize the volunteers who contribute to IPC standards development and other IPC activities.
Press Releases
- AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum
- Indium Corporation to Showcase Durafuse Solder Technology at Productronica India
- Universal Instruments Joins Parent Company Delta to Highlight Comprehensive Semiconductor Solutions at SEMICON Taiwan
- Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024