News
ATLANTA – UP Media Group Inc. today named Robin Foran sales director of CIRCUITS ASSEMBLY, effective immediately.Foran comes to UPMG from Penton Media, where she was a sales executive and sold advertising and exhibition space across the US.
MINNEAPOLIS – The Best of Conference and winner of the 3D track for the International Wafer-Level Packing Conference was Jessica Fredlund, Silex Microsystems. Coauthors of her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors,” include Toby Ebefors, Silex Microsystems, and Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.
TAIPEI -- An investigation into alleged bribe-taking at Foxconn is underway, and the EMS giant says it will cooperate in full. Authorities are looking into the dealings of at least 10 company executives following reports last year that workers in its SMT group had been taking bribes from suppliers.
Press Releases
- Innominds and SIIX launch SIIX-Innominds JV to offer full-stack ODM services in India
- Syrma SGS Technology, Ltd to Accelerate AI-Driven Manufacturing with implementation of analytics and AI solution from Arch Systems in partnership with NMTronics India
- TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
- SMTA “Members of Distinction” Awards Announced