News
ZURICH – Cicor Group is merging its Cicor Printed Circuit Boards and Cicor Microelectronics divisions into a single unit: Advanced Microelectronics & Substrates. The move comes after Microelectronics has failed to make significant progress over the past two years, the firm says.
NOTTINGHAM, UK – The 9th International Conference on Additive Manufacturing and 3D Printing requests abstracts focused on process and materials development, design and software developments, supply chain and management issues, and novel applications of additive manufacturing.
BROMONT, CANADA – Cogiscan and Speedline Technologies have formed an OEM partnership under which Cogiscan will provide software to harvest and report traceability data from Speedline printers.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing