News
WASHINGTON – The US House today passed legislation to reform the patent system, aiming to stop broadly written patents and so-called “trolls” who submit applications in the hopes of later capitalizing on hefty licensing fees.
ATLANTA, GA – UP Media Group seeks abstracts for PCB West 2014, to be held Sept. 9-11, 2014, in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center.
ALEXANDRIA, VA -- A quartet of Samsung engineers have been issued a US patent for a molded underfill flip chip package in which a semiconductor chip is mounted on a printed circuit board through bumps. The invention will prevent or reduce warpage and voids in the semiconductor package so as to increase reliability of the semiconductor package, the inventors said in the patent filing.
Press Releases
- Syrma SGS Technology, Ltd to Accelerate AI-Driven Manufacturing with implementation of analytics and AI solution from Arch Systems in partnership with NMTronics India
- TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
- SMTA “Members of Distinction” Awards Announced
- Yamaha reveals software innovations to boost printing, mounting, and intelligent factory