News
AUSTIN – Flip chip in package is expanding in mobile computing, especially smartphones and tablets. In units, the compound annual growth rate from 2011 to 2016 is almost 26%, says TechSearch International.
BANNOCKBURN, IL – January North American printed circuit board shipments were down 1.1% year-over-year, and orders decreased 4% compared to January 2012, says IPC.
SAN JOSE -- Fab equipment spending for Front End facilities is expected to hover around flat in 2013 and with an increase of 24% in 2014.
Press Releases
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market
- SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
- Coherix Unveils Industry-First Service Program for Adhesive Dispensing Systems
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