News
LYON, FRANCE – Demand for so-called "mid-end" tools and related materials for wafer-level packaging is surging, thanks to the growth of 3D IC and wafer-level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer bumping.
ORLANDO – The DMSMS & Standardization Conference will take place here Nov. 26-29. It will include panels, briefings and training on the counterfeiting issue.
Press Releases
- Universal Instruments Joins Parent Company Delta to Highlight Comprehensive Semiconductor Solutions at SEMICON Taiwan
- Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024
- Hanwha Techwin Automation Americas Announces Distribution Partnership with Neotel Technology in the Americas
- Dr. Jennie Hwang to deliver Professional Development Course (PDC9) on “Artificial Intelligence Era – Opportunities, Challenges, Possibilities” at SMTAI 2024 on October 21