LYON, FRANCE – Demand for so-called "mid-end" tools and related materials for wafer-level packaging is surging, thanks to the growth of 3D IC and wafer-level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer bumping.
ORLANDO – The DMSMS & Standardization Conference will take place here Nov. 26-29. It will include panels, briefings and training on the counterfeiting issue.