News
EDINA, MN -- The SMTA seeks abstracts on a range of topics in surface mount assembly and electronics packaging for the 2013 Pan Pac Symposium.
The abstract deadline is Sept. 7. The event takes place in Maui, Hawaii.
Submit abstracts and view more info at smta.org/panpac/call_for_papers.cfm
CHENGDU -- Foxconn's campus here was reportedly the scene of a massive riot Monday night as as many as 1,000 workers faced off against company security guards.
NEW YORK -- A rebound in demand for telecommunications equipment is increasingly unlikely for 2012, according to a pair of the leading EMS suppliers in that area.
Press Releases
- Altus Group Expands Aftersales Team to Its Largest Size to Date
- Incap Estonia Invests in New Flying robe System to Advance Production Performance
- Critical Manufacturing Partners with Canonical to Expand Cloud-Native Deployment Options for Manufacturers
- Heller Industries Becomes the Latest Partner to Join THE SMT FUTURE EXPERIENCE