News
MILPITAS, CA – Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month, SEMI announced in its 200mm Fab Outlook to 2026 report.
SANTA CLARA, CA – The Printed Circuit Engineering Association (PCEA) today announced Rick Hartley as recipient of the annual PCEA Leadership Award, for his lifetime service in the pursuit of educating and training PCB design engineers.
SANTA CLARA, CA – The Printed Circuit Engineering Association (PCEA) today announced Bob McCreight as recipient of the second annual PCEA Membership Award. The announcement was made at the PCEA annual meeting in conjunction with the PCB West conference and exhibition.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing