ARLINGTON, VA – JEDEC Solid State Technology Association announced a broad spectrum of ongoing standards development work related to 3D-ICs.
The Solid State Memories Committee (JC-42) has been working since June 2008 on definitions of standardized 3D memory stacks for DDR3. The DDR4 standard will be implemented with 3D support from the start.
The Multiple Chip Packages Committee (JC-63) is currently developing mixed technology pad sequence and device package standards. An active Task Group of the Low Power Memories Subcommittee (JC-42.6) is developing standards for wide I/O mobile memory with TSV interconnect stacked on system on a chip application processors.
The Silicon Devices Reliability Qualification and Monitoring Subcommittee (JC-14.3) has been working on reliability interactions of 3D stacks and has released JEP158: 3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Understanding and Evaluating Reliability Interactions. In addition, reliability test methods developed by JC-14.1 and JC-14.2 and quality documents developed by JC-14.4 are applicable to 3D-IC packaged and unpackaged evaluations and qualifications.
GARBSEN, GERMANY – LPKF is expanding its space here, adding a 32,000 sq. ft. building and combining R&D departments there.
LPKF plans to move into the new building in June.
The old building will be used for manufacturing laser systems.
The expansion investment is about 5 million euros.
The firm has hired 100 new employees during the past two years, for a total of 470.
MELBOURNE, FL – Contract electronics manufacturer Anuva Manufacturing Services has acquired the assets of BT Manufacturing Co.
No financial terms were disclosed.
Privately held Anuva builds printed circuit board assemblies, subassemblies, and systems.