News
SAN JOSE – The 90-day average bookings at North America-based semiconductor equipment manufacturers fell nearly 35% year-over-year in August amid uncertainties over demand.
TAIPEI – Hon Hai (Foxconn) was unsuccessful in selling a $205 million five-year bond issue, according to published reports.
The firm says offers for the unsecured bonds did not meet expectations, but did not say whether the company would reopen the bond.
The electronics manufacturing giant failed to sell a separate seven- and 10-year offer in May. When it reoffered the bond, a five-year offer sold at a higher yield than anticipated.
Hon Hai has sold more than $404 million in bonds this year.
WASHINGTON – The Bureau of Industry and Security and China’s Ministry of Commerce will assemble the third annual US-China High Technology Working Group Public-Private Sector Dialogue on Sept. 26.
Participants will focus on how to use the export control system to conduct high-tech trade in commercial products.
They will also provide real-world examples of success in high-tech trade in the aerospace and semiconductor sectors, including how comprehensive compliance programs contribute.
Visit http://www.regonline.com/builder/site/Default.aspx?EventID=1002721 to participate.
Press Releases
- Tagarno Sees Strong US Sales Growth in 2025, Driven by T50 and Software Demand
- Kimball Electronics Sets Date for Ribbon-Cutting at New Indianapolis Medical Manufacturing Facility
- Nordson’s SELECT Synchro Selective Soldering System Helps Kamstrup Advance Automation, Increase Output 20%, and Reclaim 6 Meters of Factory Floor Space
- Pinnacle Technology Group, Now PTG Electronics, Launches New Brand Identity, Strengthening Its Commitment to Innovation and Progress