News
LAS VEGAS – CIRCUITS ASSEMBLY today announced winners of the 2011 New Product Introduction Award for electronics assembly equipment, materials and software.
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TAIPEI -- Foxconn Technology Group announced plans to invest up to $12 billion in new manufacturing capacity and related services in Brazil.
LYON, FRANCE -- Flip chips made up 13% of all IC packages sold in 2010, and some 29% of the global IC assembly, packaging and test market, a new research report says.
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