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LOS ALTOS, CA – After a rare two-year drop in global communications equipment production, hardware OEMs are headed for a strong rebound this year.

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BANNOCKBURN, IL – Several new topics and features have been incorporated into 2011 IPC International Technology Roadmap to provide data and comparisons between technologies and reliability.

The latest Roadmap, which is set to be published next spring, expands the regional analysis and comparisons. The substrate and assembly sections, for example, provide insight into the regional differences in capability between Asia, Europe and North America.

Another addition is the link of emulators to industry standards and specifications. A new section discusses changes needed in industry standards to make them relevant to tomorrow’s needs.

The committee invites anyone interested in joining the final meetings from November through January to contact JeanneCooney@ipc.org.

The roadmap will be unveiled at IPC Apex Expo in April.

SINGAPOREVenture Corp. Ltd. reported revenue of $524.1 million for the quarter ended Sept. 30, up 3.7% sequentially.

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