REL61 lead-free solder alloy offers thermal cycling performance for such applications as LED lighting, in-cabin automotive electronics and high power applications. Reliability and performance characteristics equal to or greater than SAC 305 and other low/no-silver solder alloys. Mitigates tin whisker formation. Improves spread, flow and wetting versus low/no-silver alloys. Comes in bar, wire or paste.
AIM Solder
www.aimsolder.com/products/high-reliability-alloys
XPRS multi-level direct flow inline test handler for assembled PCBs can be tailored based on each product and production process.