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REL22 low Ag SAC solder contains bismuth and melts at about 208°C.

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REL61 lead-free solder alloy offers thermal cycling performance for such applications as LED lighting, in-cabin automotive electronics and high power applications. Reliability and performance characteristics equal to or greater than SAC 305 and other low/no-silver solder alloys. Mitigates tin whisker formation. Improves spread, flow and wetting versus low/no-silver alloys. Comes in bar, wire or paste.

AIM Solder

www.aimsolder.com/products/high-reliability-alloys

XPRS  multi-level direct flow inline test handler for assembled PCBs can be tailored based on each product and production process.

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