Products
Designed for advanced electronics and AI hardware, the Dymax 9310 adhesive cures in seconds with light, delivering a streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies.
It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments.
Featuring a fully shielded design, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing electromagnetic interference in compact electronic systems. The 0.35mm-pitch connector combines power and signal contacts in a 0.6mm stacking-height design, providing four 2.5A power contacts and a fully armored housing for high-frequency, space-constrained applications.
Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch connector combines power and signal contacts in a compact 0.6mm stacking-height design, providing four 2.5A power contacts and a fully armored housing for high-reliability, space-constrained applications such as smartphones, tablets, wearables and notebook PCs.
Press Releases
- Altus Group Invests in Major Headquarters Expansion to Showcase Complete Turnkey Manufacturing Capability
- ViTrox Americas Welcomes Eric Cruz as Technical Support Engineer
- ECD Strengthens Engineering Team with New Software Development Hire
- ViTrox Americas Welcomes Doug Ennis as Senior Field Applications & Service Engineer