Products
Chip mounters support high-speed SMT assembly with placement rates up to 95,000 components per hour. The systems reduce board recognition time by approximately 30% and use vision-based alignment and calibration to improve placement accuracy and minimize component loss. They handle a wide range of components and support PCB weights up to 4.5kg. The platforms include updated user interfaces and are designed for integration with smart factory environments and automated material handling systems.
Slot-die coater supports thin-film deposition on rigid substrates and flexible materials for research and development applications. The system integrates a vacuum chuck, syringe pump, and heating for controlled coating and drying in a single unit. It enables film thickness control from nanometer to micrometer scale and supports slot-die, bar, knife, and flexo coating methods. The platform is available in two sizes and can be configured for roll-to-roll processing. It is designed for use in laboratory environments including gloveboxes and fume hoods.
EP6STC-80 is a one-component, non-frozen, silver-filled epoxy designed for bonding, sealing, and coating applications requiring thermal and electrical conductivity. The system provides unlimited working life at room temperature and cures at 80°C. Thermal conductivity is rated at 13–14W/(m·K), with volume resistivity below 0.001ohm-cm. Operates across a temperature range of -60°C to 150°C and bonds to metals, ceramics, composites and plastics. It meets NASA low outgassing requirements and contains no solvents or diluents. The epoxy exhibits a tensile modulus of 1,400,000–1,800,000psi at 25°C and cures in 3–5 hours at 80°C. Formulated as a thixotropic paste with viscosity between 500,000–1,500,000cps, supporting manual and automated dispensing. Packaging options include syringes from 20g to 100g and jars up to 200g.
Press Releases
- Express Manufacturing Enhances Test Capabilities with Takaya APT-1600FD-SL Investment
- Distron Corporation Expands In-House Capabilities with Automated Conformal Coating for Complex PCB Assemblies
- Eastek International Corporation Appoints David Strabel as Vice President of Manufacturing
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027