Products
630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.
Electrovert EcoWave wave soldering option designed to enhance solder performance, reduce dross formation and extend maintenance intervals in electronics assembly operations. Patented single-wave nozzle integrates DwellFlex 4.0 adjustable contact length and Auto Exit Wing defect-mitigation technologies to improve wave stability and process consistency. Nitrogen-directed wave-forming design minimizes oxidation, with reported dross reductions exceeding 50% and reaching up to 75% in some applications. System maintains solder above liquidus throughout the contact sequence to improve plated-through-hole fill and joint integrity without increasing nitrogen consumption. Design reduces mechanical complexity and dross accumulation, with manufacturers reporting maintenance interval extensions of up to 93%.
Vitronics Soltec ProcessGuard option designed for inline thermal monitoring and analytics within reflow soldering processes. System provides real-time visibility into heating and cooling zone performance to reduce routine profiling and support early defect detection. Compatible with third-party data loggers for baseline profile validation. Integrated directly into machine software with MES connectivity for traceability and smart factory integration. Includes redundant thermocouples in heating and cooling zones, quick-connect thermocouples for maintenance, and embedded ProcessGuard analytics interface. Field-upgradeable for Vitronics Soltec Centurion reflow ovens.
Press Releases
- Distron Corporation Expands In-House Capabilities with Automated Conformal Coating for Complex PCB Assemblies
- Eastek International Corporation Appoints David Strabel as Vice President of Manufacturing
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Koh Young Announces Two Sales and Service Changes to Strengthen its Customers in the US and Canada