Products
Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.
Print Param Decision Assist software tool evaluates PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction (NPI). The tool analyzes board dimensions, component types, solder-paste type, stencil thickness and aperture geometry to calculate settings including system pressure, printing speed, squeegee angle and stencil cleaning frequency. Integrated into the latest release of YSUP-PG, the programming environment within Yamaha’s YSUP intelligent factory software suite. A graphical interface allows operators to review recommended parameters and adjust settings before production. Intended to support faster NPI setup and parameter verification during stencil printing processes.
Rigol DNA5000 and DNA6000 Series vector network analyzers support RF and microwave analysis across a frequency range from 5kHz to 26.5GHz. Available in 2-port and 4-port configurations, the instruments support testing of passive components including filters, antennas, cables, dielectric materials, and high-speed interconnects. The analyzers offer dynamic range up to 127dB and low trace noise to support characterization of high-rejection devices and stable measurement performance. Fixture removal and de-embedding functions allow measurement correction for test fixtures, adapters, and cables, enabling direct S-parameter analysis of the device under test. Built-in analysis tools include limit testing, standing wave ratio (SWR) measurement, Smith chart display, and time domain reflectometry (TDR). An integrated calibration wizard guides setup procedures to support measurement repeatability across laboratory and production environments. The instruments feature a touchscreen interface and support HDMI, LAN, USB, and GPIB connectivity for integration with automated test systems. The compact DNA5000 Series targets bench-space-constrained environments, while the benchtop DNA6000 Series supports long-duration testing and automated production test configurations.
Press Releases
- Distron Corporation Expands In-House Capabilities with Automated Conformal Coating for Complex PCB Assemblies
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- Koh Young Announces Two Sales and Service Changes to Strengthen its Customers in the US and Canada