Products
SolderKing released SAC0307, a low-silver alloy option within its SK P2-5 solder paste family designed to support flexible alloy selection while maintaining the same established flux chemistry and process settings. The paste enables manufacturers to evaluate alternative alloy compositions without modifying existing production parameters. Designed for surface-mount assembly applications requiring reliable stencil printing and consistent wetting across common PCB finishes including OSP, ENIG, immersion silver, tin and HASL. The flux formulation is designed to reduce voiding and head-in-pillow defects while leaving minimal residue after reflow. The material complies with J-STD-004B and Bellcore ECM requirements. Available in Type 4 (20–38µm) and Type 5 (15–25µm) powder grades to support fine-pitch and high-density assemblies. Extended tack and open times exceeding three days provide flexibility for longer production runs or staged builds, while a 12-month refrigerated shelf life supports material inventory management.
SolderKing Assembly Materials
OE in a Box packages the key materials required to generate IPC J-STD-001 objective evidence reports for electronics manufacturing reliability validation. Kit includes B-52 Legacy 2 test cards, taped components, a stencil offering from Metal Etch Services, ESD bags and other materials needed to perform surface insulation resistance (SIR) testing preparation. Simplifies the process by shipping all required items in a single kit with return logistics so manufacturers can quickly send completed boards to Magnalytix for third-party testing and validation reports. Platform is designed to accelerate reliability verification, support compliance documentation and streamline testing workflows.
TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.
Press Releases
- Distron Corporation Expands In-House Capabilities with Automated Conformal Coating for Complex PCB Assemblies
- Eastek International Corporation Appoints David Strabel as Vice President of Manufacturing
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Koh Young Announces Two Sales and Service Changes to Strengthen its Customers in the US and Canada