Summit LT150 rework system supports rework of components up to 150mm on large, high-density electronics assemblies. Platform includes a 150×150mm vision area that allows full-component viewing while enabling corner-level alignment during placement. System accommodates board sizes up to 24×36in, with optional configuration for larger formats. Rework platform provides up to 100mm top- and bottom-side clearance to allow access around tall connectors, heat sinks, and power modules commonly used in high-power assemblies. Thermal system combines a 4.4kW top heater with up to 11.2kW of bottom-side heating to support temperature uniformity across large component footprints. Dual PID control, programmable airflow, and a 1.5kW spot heater support thermal profile adjustment during rework operations. System developed for electronics manufacturing environments addressing large components used in AI and power electronics assemblies.
Custom Samsung nozzle (Part #2026-5654) supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 pick-and-place platforms. Design incorporates a Samsung-style nozzle base with a standard reflector size for machine recognition and a precision plastic tip measuring 4.50mm × 4.50mm to match the LED package geometry. Tip construction is intended to maintain stable vacuum pickup while protecting sensitive LED surfaces during high-speed SMT placement. Component is designed for application-specific SMT assembly where nonstandard component shapes require specialized nozzle tooling.
MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.