Products
TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.
Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.
Stackpole’s RNWA is a thin film chip resistor with all the benefits of wide terminations and is capable of tolerances to 0.1% and TCR as low as 25ppm.
Press Releases
- ViTrox Announces Strategic Partnership with Maxim SMT to Strengthen Presence in India
- Incap UK achieves JOSCAR Zero accreditation – Strengthens its position in the defence and aerospace sector
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030