Products
VersaFlex-Ultra selective solder module features two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles.
X7056-II inline automatic 3D X-ray inspection machine features a new handling concept called xFastFlow for printed circuit boards change in as few as 4 sec.
E-Z Step stepped stencils are used to facilitate an increase or decrease of paste volume and deposit height on selected printed circuit board areas with mixed component technology, large ground pads, intrusive reflow or coplanarity issues. Step areas are 20 to 150µm with support of complex shapes. Step ramp is in 50µm increments. Positional accuracy is <10µm on step areas. Material thickness is +/-2%.
MET Stencil
www.metstencil.com
Press Releases
- PARMI Enhances Support for Brazilian Electronics Manufacturers with New Local Partnership
- ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
- BMK strengthens its coating expertise for electronic assemblies with a technology initiative
- Altus Group Strengthens Leadership with New Operations Director