Lumet P53 solder paste with SBX02 alloy is for LED package assembly on PET flexible circuits; provides low-temperature LED package on PET reflow capability, enabling the use of PET flex substrates. Enables the use of SAC or Maxrel solder-based die attach in package.
Alpha, http://alpha.alent.com/Markets/LED
20-2121 polyurethane plant-based potting, casting and encapsulating compound for electronic applications with low toxicity requirements. Is made from natural oil polyol instead of fossil fuel feedstocks. Meets FDA food contact requirements and contains no TDI, MbOCA or Mercury. Is said to offer little shrinkage or exotherm, alleviation of mechanical and thermal stresses on sensitive electrical components, limited stress on electronics with good elastomeric properties. Tensile strength of 2,000 psi and a tear strength of 119 PLI. It has a mixed viscosity of 2,000 cps at 25°C and a gel time of 20 minutes at 60°C.
Epoxies Etc., http://www.epoxies.com/try-adhesives.aspx
CC7090E and CC7130-E Prima Protect conformal coatings are for moisture and salt fog protection. Offer moisture, salt fog and direct immersion protection for electrical contacts, electronic circuits and devices, printed wiring boards, and structures made with metal, wood and plastics. Are molecularly flexible for good adhesion; resist abrasion. Have flexibility to withstand low temperature cracking, fungicide to provide protection in submerged environments, and are non-silicone and electrically insulating. Are designed to meet IPC-CC-830 requirements with UV inspection dye and fungi-resistance. Can be brushed, dipped or sprayed on.
AI Technology, www.aitechnology.com